5G will change the category requirements structure of PCB
5G is coming soon
China’s current 5G testing and pilot work is progressing smoothly.China Mobile, China Telecom and China Unicom’s three major
operators have similar 5G development plans. In 2018, they will continue to expand the scale of field trials and in 2019, they will conduct commercial trials
and formally commercialize them in 2020.And also,with the development of 5G, the PCB category demand structure will also change,
there will be an increase the demand for high value-added PCB products
such as high-speed high-frequency multilayer boards, HDI, and flexible boards.
On one hand, 5G pulls the base station scale and the consumables to grow, PCBs are commonly used in antennas for antenna modules,
communication backplanes, power amplifiers, low noise amplifiers, filters, and more.
On the other hand,in the 5G era, with the technical requirements of high frequency, high speed and high data volume,
many of the original low and medium frequency communication materials will be eliminated,
and the PCB is irreplaceable due to dielectric characteristics and signal transmission speed.
However,the large increase in the use of high-frequency high-speed components is just around the corner.
PCB used for 5G
5G is mainly used in the field of TMT, and its development has a major impact on PCB in two aspects.
First, 5G new communication base stations have a large demand for high-frequency circuit boards,
second, 5G replaces the PCB boards used in mobile terminals, mainly based on HDI and flexible boards.
At present, PCB requirements for communication equipment are mainly 8-16 layers of high-frequency multi-layer boards (8-16 boards account for 35.18%
and there is less demand for HDI and flexible boards, which are 3.83% and 2.73% respectively.
In addition, the PCB requirements of mobile terminals are mainly concentrated on HDI, flexible boards and package substrates.
HDI accounts for 50.68%, flexible boards account for 47.92%, and package substrates account for 26.36%.