• What is wave soldering?

    Wave soldering is to make the solder side of the PCB directly contact with high temperature liquid tin for welding purposes,its high temperature liquid tin maintains an inclined surface, and a special device makes liquid tin form a wavy phenomenon, so it is called “wave soldering”,its main material is soldering tin bar. Wave soldering is currently the most commonly used and effective method, wave soldering system has a large enough tin can handle the maximum circuit board width you expect.Wave soldering is suitable for medium batch or large quantity welding. Advantage:...

  • The advantage of robot in PCB industry

    The advantage of robot in PCB industry Like the automobile industry and other manufacturing industries, industrial robots have brought many advantages to enterprises in the PCB industry. 1.Reduce the use of work, speed up the pace of work, improve work efficiency. 2.Improve operation precision and product quality. 3.To avoid the potential threat to the health and safety of workers from the operating environment and save the investment in environmental safety. 4.Reduce the loss of efficiency, quality and accident rate caused by repeated and boring processes...

  • Why PCB Design Software is Proving So Vital to Modern Circuit Board Ingenuity

    Printed circuit board (PCB) design software is a remarkable tool when it comes to designing PCB for electronic devices. By using the PCB design software, an engineer not only addresses issues associated with power integrity and signal, but is also able to modify and improve the entire circuit structure. PCB design software can be easily integrated with other associated plugin PLM software that can assist engineers to better analyze layouts and designs of PCBs. In recent years, the demand for PCB design software from the electronics manufacturing industry has been robust. According to the latest data released by Future Market Insights (FMI), the global market for PCB design software is set to witness a CAGR of more than 12% between 2016 and 2026 to rake in $4,755.1 million in revenues by the end of the forecast period. Needless to say, PCB design software eliminates issues faster and significantly reduces circuit......

  • The veteran’s answer about Crystal Oscillator (Part one)

    Someone who has just started to join in Electronic Industry,they often faced the questions about Crystal Oscillator,even they have researched a lot of resources from refernce books or internet,but many of them are still in confusion. Today I share with you some typical questions and answers from the veteran electronic engineer. What’s the fonction of Crystal Oscillator? The main fonction is providing a clock signal for the whole system. For example,the run model of CPU is step by step,every step defined an instruction that base on Crystal Oscillator. What’s the relation between Crystal Oscillator and timing sequence? Timing sequence is counted on the clock’s order,and the clock is generated by a Crystal Oscillator. Why we often set some different Crystal Oscillator on the same PCB? Evey different CPU or Chip has different frequencies,they need matched Crystal Oscillator to run. For example,USB1.1 needs 48MHz clock to be divided, so 12MHz crystal......

  • The veteran’s answer about Crystal Oscillator (Part two)

    USB1.1 needs 48MHz clock to be divided, so 12MHz crystal oscillator is required, and the frequency is 4 times that of 48MHz. Why don’t choose 48MHz Crystal Oscillator directly? Because high frequency crystal oscillator is easy to be affected by peripheral circuits or affect peripheral circuits. Most of the time,we get high frequency by using low frequency crystal oscillator with second harmonic generation. But it’s not absolute,many circuits is often used a crystal oscillator of 50M or more. That’s a key point that we need a special attention when we do PCB layout.   Why we use 32.768KHz crystal oscillator when the RTC clock needs a more accurate 1S (1 second)? Because all digital circuits are expressed by binary system,32768 is 1000000000000000 in binary system. So as long as we detect the highest bit changes, we will know that 1 second, don’t need to check every bit, the circuit is......

The printed circuit board Output in Korea in 2018

The PCB production value sales is slow in Korea due to FPC board. In 2018, the domestic PCB production value was 9.8 trillion won (annual decline of 3.0%). The growth of global smart cell phone manufacturing has slowed down,causing the sales of RF components HDI substrates to decrease more than the sales growth of semiconductor PCBs. And the increase in sales of semiconductor PCBs is due to the increase in memory card demand. In 2018, the output of Korean printed circuit boards manufacturing industry reached 33.9 million square meters, with an annual decline of 3.8% The production output scale of rigid PCBs was 24.82 million square meters,with an annual decline of 3.1% However, as the demand for RF components fell,the Flex PCB industry segment fell by 9.3%. The semiconductor PCB with high added value per unit area has an annual growth rate of 5.4% and a production capacity of 2.55 million square meters. In South Korea, the market in Korea  limited by the extension of the smart phone replacement...

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What is the PCB value of the 5G base station?

PCB global production value is currently about 63.5 billion US dollars, while mainland China has more than 50% of the output value and this proportion will continue to rise with the growth of domestic factories. In addition, 5G construction, consumer electronics, and automotive electronics and other aspects of the PCB in the 5G pull the new market The price of PCBs for 5G base stations has doubled,which strongly drives the demand for PCBs. We estimate that the PCB value of a 5G base station is about 12,500 yuan,which is about 3 times that used by previous 4G base stations However,the downstream consumer electronics of 5G ,let's say, smart mobile phone market deeply affected by 5G. And the penetration rate of FPC and SLP will continue to increase.Under the general trend of 5G, mobile phones that are still in the 4G era will face major changes in internal structure The power required for 5G mobile phones will be larger than that of 4G mobile phones, and the internal battery of the mobile...

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Manufacture of high-density multi-layer Rigid-flex PCB boards

In order to meet the low-cost, high-density requirements of consumer-grade rigid-flex pcb boards, at present, people have already developed several new processing technologies for rigid-flex pcb in the market.        Figure 1   As shown in Figure 1,this new processing technology uses a buried or inner microporous structure to optimize the space of the inner conductor layer. However, the via hole processing for the inner layer is the same as the via hole processing for the double-sided flexible board. In addition, we  usually recommend to use a cast or laminated non-adhesive substrate for the material which can reduce the drilling waste and ensure the good performance of the rigid-flex pcb under various high temperature process conditions for rigid-flex pcb    ...

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Let’s Talk About Industrial Grade Rigid Flex PCB With High Density

As we all know,HDI rigid-flex pcb boards, the rigid-flex pcb which has high-density wiring design with fine circuit and microporous structure have not been used in aerospace products. Because many people consider that they are  not sufficiently reliable under harsh environmental conditions And also,people can only use the conventional soldering means to mount the terminal components on this PCB. However,many companies already have begun to use this HDI rigid-flex pcb boards with both high-density design and high reliability in industrial electronics  and medical electronics products. A new design concepts and installation methods of HDI rigid-flex pcb for terminal products have emerged In addition, on this high-density of rigid-flex pcb,the general line spacing is less than 100 um and the hole aperture is less than 100 um,and we use the 25um thick or even thinner non-adhesive thin copper polyimide CCL What's more,  the rigid-flex pcb copper thickness is mostly 18um or less, and we use laser drilling technology to process the Micro-holes, especially the laser blind hole technology often used in the lamination process for rigid-flex pcb manufacturing Correspondingly,some high-density, high-reliability terminal assembly...

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Design Ideas Of Rigid Flex PCB For Consumer Electronics

In order to reduce the conflict between high density and low cost. And ,some new design ideas of rigid flex pcb we use in commercial consumer electronics are shown in the following table: rigid flex pcb Substrate film: polyimide ≤25um rigid flex pcb CCL: cast or laminated non-coated copper clad laminate rigid flex pcb Conductor: copper foil ≤18um, conductor layer is less than 10 layers rigid flex pcb Via hole form: through hole, inner buried hole, blind hole rigid flex pcb Minimum aperture: 50um Line density: Inner layer: minimum line width / line spacing 25um Outer layer: minimum line width / line spacing 50um Copper plating thickness: ≤15um Cover film: polyimide, 25um or 12.5um Adhesive material: epoxy resin or acrylic resin ≤50um Rigid outer layer material: glass-epoxy resin≤250um Polyimide substrate≤50um Solder mask: Photosensitive solder mask Surface treatment: immersion gold, lead-free HAL, OSP In additional, the  rigid flex pcb dimension should be as small as possible. However, a thinner rigid flex pcb material than aerospace or industrial grade products can be used to reduce the total thickness of the product. And also,...

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About IC-Substrate board ,There is something you should know

From the perspective of the main business of global IC Substrate board leading enterprises, the majority of the development from the PCB business. At present, from the perspective of the global IC Substrate board , there are three main types: 1) Developed by PCB companies Since the package substrate is developed from high-order HDI boards, both of which have a common expenditure on the manufacturing process. However,many PCB manufacturers can extend the development of the IC Substrate board business. Such as Xinxing Electronics (a subsidiary of UMC) in Taiwan, South Asia and Huatong Computer, etc. South Circuit and Xingsen Technology also belong to this category 2) Developed by the packaging factory In addition,theIC Substrate board is also a kind of packaging material, and the packaging factory will also develop upstream in order to reduce costs and attract customers. 3) Pure IC Substrate board companies The IC Substrate board has a high threshold and has great potential for development. Therefore, some large companies have set up substrate subsidiaries. Domestic...

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RCY ELECTRONIC :Rigid-flex PCB new product release ( VI )

1   Product picture display   2  Product information and Application Application:Motor train track monitoring layer count :3L Thickness:1.6 mm Copper Thickness:1/3OZ Min. hole size:Blind Via 0.1mm Surface finish:ENIG process difficulty: HDI, FPC outer structure, FR4 reinforcement   Stack-up diagram:       3  Manufacturing flow:   Main flow FCCL Cutting -> Drilling -> Inner Line -> Coverlay Fit -> Browning -> Combination -> Press -> Drilling -> Laser Drilling -> Full Plate Plating ->Outer Line -> Graphics Electroplating->Alkaline etching->solderproof->Mechanical control deep opening cover ->Chemical->Text->Laser soft board shape->Reinforcement fit     4  Process difficulties: a. High TG material selection, soft board material plating copper Coverlay filling. b. NF PP+ high TG FR4 pressing process. However,soft outer structure, high temperature resistant gasket filled with NF PP window design, improved soft and hard junction recess after pressing. c. Reinforcement and core board share the design of the press-fit structure to reduce the process flow and enhance the reinforcing bonding force. d. The soft-plate laser blind hole process, positive and negative laser + mechanical control deep process, to meet the thick cover open cover design. e. Anti-welding large hole plug hole requirements, the use of...

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RCY ELECTRONIC :Rigid-flex PCB new product release ( V )

1   Product picture display 2  Application Application:industrial camera/ Communication electronics layer count :8L Thickness:1.2mm Copper Thickness:1/3OZ Min. hole size:0.2 mm Surface finish:ENIG process difficulty:High multi-laminate, short slot process, small BGA process Stack-up diagram:     3  Manufacturing flow:   Main flow FCCL Cutting->Drilling->Inner circuit->Coverlay->Brown Oxide->Bonding->laminating ->Panel PTH-> outer circuit->pattern PTH->Etching>solder mask->Immersion gold->FPC UV lasering->E-TEST->Outline->FQC   4  Process difficulties: a. Material selection, communication class, choose DuPont material PI 50um, copper thickness 18um; high TG NF PP+FR4 material, DF<0.002. b. High multi-layer NF PP pressing process, positive and negative control deep open cover structure design; NF PP laser window opening, CORE plate laser counter control deep, mechanical control deep open cover. c. Short slot hole process, this board has short slot hole deformation problems, which is improved by optimizing the drilling resolution. d. Anti-welding black oil dense BGA (0.25mm) process, matte black oil, soft and hard board ink printing uneven improvement. e. Multiple sets of differential, single-ended impedance process design, different layers of soft board and hard board impedance design.   5  Product application : Industrial control system for industrial control dynamic sensing, integrated high-speed imaging chip, dynamic scanning,...

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RCY ELECTRONIC : Analysis of PCB Industry

As we all know,there are many kinds of raw materials we need to use for PCB manufacturing industry. For example, mainly copper clad laminates, prepregs, copper foil, copper balls,  inks, dry films and other materials. However,  CCL is the basic material for making printed circuit boards, and companies can  only use the CCL in the manufacture of printed circuit boards. And ,the two have strong relationship of interdependence. On one hand ,the manufacturing technology and supply level of CCL is an important foundation for the development of the PCB industry. On the other hand,the development of PCB will also have an important impact on the demand and development of CCL What's more, we can see that CCL accounts for about 20% to 40% of the total printed circuit board production cost, and has the greatest impact on the cost of printed circuit boards. In addition to copper clad laminates, copper foil and copper balls are also important raw materials for PCB production. However,people said that the price of copper foil and copper...

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RCY ELECTRONIC :Rigid-flex PCB new product release ( IV )

1   Product picture display 2 Application:Smart wearable system/Consumer electronics layer count :4L Thickness:1.0 mm Copper Thickness:1/2OZ Min. hole size:0.2 mm Surface finish:ENIG process difficulty:Flying tail structure, fixed depth drilling Stack-up diagram:   3  Manufacturing flow: Main flow FCCL Cutting->Drilling->electroplating->Brown Oxide->Inner circuit->Coverlay->Bonding->laminating ->Panel PTH-> outer circuit->pattern PTH->Etching>solder mask->Immersion gold->FPC UV lasering->E-TEST->Outline->FQC   4  Process difficulties: a. This product adopts a flying tail structure, and the soft board needs to be selectively pressed after plating. Soft plate selective plating process; electroplating thick copper NF PP press-filling process b. Double-sided deep drilling process with high-precision drilling rig (contact induction current). After deep drilling, copper plating and mechanical blind hole process are required. c. Multiple sets of differential, single-ended impedance process design; different layers of soft board and hard board impedance design. e. Positive and negative laser + laser depth control process to improve open cover loss       5  Product application : Intelligent wearable system for the collection and analysis of human health data. The board is equipped with a human body contact sensing intelligent module, and is equipped with a soft and hard board to realize a light...

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Shenzhen Renchuangyi Electronics Co., Ltd
Tel: 0755-27314226
Address:
Building 4, JinFeng Industry Zone, Heping Village, Fuyong Town, Bao’an District, Shenzhen, Guangdong Province, PRC.:
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