Flexible printed circuit (FPC) is extensively used in smartphones to connect parts and motherboards, such as display modules, fingerprint modules, camera modules, antennas, vibrators, etc. With the continuous penetration of fingerprint recognition, the upgrade of the camera to dual-camera, and the use of OLED, FPC usage in smartphones will continue to increase. With the gradual popularization of dual-camera and three-camera, the future growth of camera modules is still relatively large.
We expect that it reaches 45% in 2019. Huawei mobile phone is a strong promoter of dual-camera. In 2017, dual-camera shipments accounted for more than 50%. , Vivo, Apple followed
However, according to survey data, 2017 CMOS image sensor sales reached 11.5 billion US dollars (+9%), 2016 ~ 2021, CMOS image sensor market size compound annual growth rate of about 8.7%. At the same time, with the release of Huawei and Samsung foldable mobile phones, future foldable mobile phones will push up the
demand for flexible AMOLEDs. According to the survey data, shipments of flexible AMOLEDs are expected to reach 180 million units in 2018, three times more than the 46.5 million units in 2015. Besides, we can estimate that shipments will reach 336 million units by 2020, accounting for more than 50% of AMOLED shipments. And also, in the field of smartphones, 2017 shipments of flexible On-CellAMOLEDs reached 96.3 million, an increase of 154% year-on-year, accounting for 6.3%; iPhone X uses GF2OLED panels, and total shipments of On-cell+GF2 AMOLEDs accounted for 2017. Up to 9.9%, this proportion is expected to be about 30% in 2022.