Author Archives: RCY

The history of Surface Mount Technology (SMT)

Surface mount technology is developed from the manufacturing technology of component circuits. From the 1970s to the present, the development process of SMT has gone through three stages: The first stage (1970 to 1975): The main technical goal is to apply miniaturized chip components in the production and manufacture of hybrid circuits (called thick film […]

The background of Surface Mount Technology (SMT)

Over the past ten years, the rapid development of electronic application technology has shown three notable characteristics. (1) Intelligence Convert the signal from analog to digital, and process it with a computer. (2) Multimedia The transformation and development from textual information exchanges to sound and image information exchanges, making electronic equipment more humanized, deeper into […]

Rigid flex PCB Manufacturing and Material Selection

With the birth and development of FPC and PCB, a new product Rigid Flex PCB was born. The rigid flex board is a circuit board with FPC characteristics and PCB characteristics, which is formed by combining the flexible circuit board and the rigid circuit board according to the relevant process requirements, and through processes such […]

The current development of Chinese PCB design automation technology

With the establishment of China’s leading position in the field of 5G technology, the pace of 5G empowering traditional and emerging industries and illuminating the future of life is getting faster and faster. This has aroused the concerns and doubts of the U.S. government and started to implement technology cut-offs for upstream companies in the […]

BH will provide more than half of the RFPCB for next-generation iPhone

According to recent news from South Korean media, benefiting from Samsung’s exit plan, South Korean circuit board manufacturer BH will provide more than half of the rigid-flex PCB (RFPCB) for Apple’s next-generation iPhone to be launched later this year. BH will provide 50% of the circuit boards, while Samsung Electro-Mechanics will provide 30%. Youngpoong Electronics […]

High speed PCB design – 6 key points

In high speed PCB design, we often encounter various problems, such as impedance matching, EMI rules, etc. This article has compiled some key questions and answers related to high-speed PCB design for everyone, and we hope it will be helpful to our readers. 1. How to consider impedance matching when designing high-speed PCB schematics? When […]

PCB stackup design that hardware engineers should know

In general, the laminated design mainly follows two rules: 1. Each wiring layer must have an adjacent reference layer (power or ground layer); 2. The adjacent main power layer and ground layer should be kept at a minimum distance to provide a larger coupling capacitance;   The following lists the stack from two-layer board to […]