Comparison of Dry Film and Wet Film for PCB Processing

The dry film is easy to operate, especially using an automatic film laminating machine, which can be mass-produced. The wet film is cheap, but it cannot be used on automatic lines. The wet film is theoretically good for thin lines, but the wet film also has many other problems. In general, the dry film is […]

Overview of Final Coatings on PCB Surfaces

The final coating process for PCB manufacturing has undergone important changes in recent years. These changes are the result of the continued need to overcome the limitations of HASL (hot air solder leveling) and the growing number of HASL alternatives. The final coating is used to protect the surface of the circuit copper foil. Copper (Cu) is […]

PCB Short Circuit Inspection Method

1. If it is manual welding, it is necessary to develop a good habit. First, visually check the PCB board before welding, and use a multimeter to check whether the key circuits (especially the power supply and ground) are short-circuited. Use a multimeter to test whether the power supply and the ground are short-circuited. In addition, do […]

Description And Reasons of Poor Plating During Electroplating

Description And Reasons of Poor Plating During PCB Electroplating: 1. Pinhole. The pinholes are due to the hydrogen adsorbed on the surface of the plated parts, and they are not released for a long time. Make the plating solution unable to wet the surface of the plated parts, so that the plating layer cannot be […]

Process Technology for Improving the Quality of Multilayer Board Laminating

Due to the rapid development of electronic technology, the continuous development of printed circuit technology has been promoted. PCB boards have developed through single-sided-double-sided and multi-layered boards, and the proportion of multi-layer boards has been increasing year by year. The performance of the multi-layer board is developing to the extremes of high precision dense fine […]

Professional PCB Multilayer Board Pressing Process Description

Professional PCB Multilayer Board Pressing Process Description 1. Autoclave It is a container filled with high-temperature saturated water vapor and high pressure can be applied. The laminated substrate sample can be placed in it for a period of time to force moisture into the board, and then take out the sample again. Place it on […]

Solder Mask Process in the PCB Board Production Process: Repairing Board

The following is the third operation procedure of solder mask process in the PCB board production process: repairing the board. Repairing the board includes two aspects, to repair the defects of the image, and to remove the defects that are not related to the required image. In the process of repairing, you should pay attention […]

Solder Mask Process in the PCB Board Production Process: Developing

The second solder mask process in the PCB board production process is developing. The developing operation is generally carried out in the developing machine, and the developing parameters such as the temperature of the developing solution, the conveying speed, and the spray pressure are well controlled to obtain a better developing effect. The development is […]