Category Archives: Industry News

CAM software automation

Some of the industry-leading manufacturers are already enjoying the great benefits of process automation, such as production capacity improvement, data quality improvement, and training time shortening. Why do we need to automate? Why CAM can’t meet all needs of the automation function that we only need to push the right button to achieve auto-output? It’s […]

How to control the bow and twist in PCB manufacturing?

The IPC-6012 provides max. bow and twist not exceed 0.75% for the PCB from SMB to SMT. This article will show you how to control the bow and twist of PCB. Let’s find out the prevention methods of PCB bow and twist: Engineering design. The arrangement of PP between layers should correspond one-to-one; Core and […]

Three difficult points in disposing high-concentration organic wastewater of PCB manufacturing

With the rapid development of China’s economy, industrial pollution is increasingly polluting the environment, government oversight is getting tougher for the standard discharge of wastewater. It is imperative to recycle sewage. High-concentration organic wastewater was produced during PCB manufacturing, but there is no authoritative survey of pollutants in China so far. This article will state […]

Widely used softwares for PCB design

1.Altium Designer. A new generation IC board-level design software, suitable for Windows XP system. It is the first software that integrated the design flow, PCB integration design, FPGA design of programmable devices, and embedded software based on processor design. it has all the functions needed to transform the design from concept to final product. 2.Cadence. […]

Surface treatment in PCB industry (ENEPIG)

8.Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Compared with ENIG, the ENEPIG has added a layer of palladium between nickel and gold. Palladium can avoid the corrosion caused by the substitution reaction, and make full preparation for the immersion gold. Merits: Suitable for lead-free soldering. The surface is very smooth and suitable for SMT. Storage […]

Surface treatment in PCB industry(I-Ag)

7.Immersion silver Immersion silver is difficult between OSP and ENIG. Even when exposed to hot, wet, and pollution, silver can keep good weldability but will lose its luster. The I-Ag does not have the good physical strength of the ENIG, because there is no nickel below the silver layer. Merits: Simple process, suitable for lead-free […]

Surface treatment in PCB industry (I-Sn and Hard Gold)

5.Immersion Tin(I-Sn) Due to all solders are based on tin, the tin coating can match any type of solder. The surface finish immersion tin can form a flat between copper and tin, this feature enables the sinter to have the same good weldability as the hot air leveling, without the headache of the unfitness in […]

Surface treatment in PCB industry (ENIG)

4.Electroless Nickel/Immersion Gold (ENIG) The general process of ENIG is: Acid cleaning -> micro etching -> presoaking -> activation -> electroless nickel -> immersion gold.There are six chemical channels in the process, involving nearly 100 chemicals, and the process is a little complicated. The ENIG is coated with a thick and electrically nickel-gold alloy that […]

Surface treatment in PCB industry(OSP and flash gold)

2.Organic Solderability Preservatives(OSP) The general process of OSP process is: degreasing -> microcorrosion -> pickling -> pure water cleaning -> OSP coating -> cleaning.The process control is relatively easy to others. OSP is a process that meets the RoHS directive requirement for PCB surface finish. It has anti-oxidation, thermal shock and moisture resistance, which can […]