Directional coupler, a passive device used in radio technology.The application of directional coupler as below: 1) For power synthesis systems. In the multi-carrier frequency synthesis system, a directional coupler with 3dB is usually used. (generally called 3dB bridge) 2) For receiver’s anti-interference measurement or stray measurement. In the FR test and measurement system, if the […]
Category Archives: About RCY
Some of the industry-leading manufacturers are already enjoying the great benefits of process automation, such as production capacity improvement, data quality improvement, and training time shortening. Why do we need to automate? Why CAM can’t meet all needs of the automation function that we only need to push the right button to achieve auto-output? It’s […]
The IPC-6012 provides max. bow and twist not exceed 0.75% for the PCB from SMB to SMT. This article will show you how to control the bow and twist of PCB. Let’s find out the prevention methods of PCB bow and twist: Engineering design. The arrangement of PP between layers should correspond one-to-one; Core and […]
We care more about layout and wiring during we design a PCB project, and often ignore the extra PCB manufacturing cost in the design. This article discusses which factors in the design affect PCB prices and avoid increasing costs to customers. 1.Number of layers. More layers easier to layout, but the price increases with the […]
With the rapid development of China’s economy, industrial pollution is increasingly polluting the environment, government oversight is getting tougher for the standard discharge of wastewater. It is imperative to recycle sewage. High-concentration organic wastewater was produced during PCB manufacturing, but there is no authoritative survey of pollutants in China so far. This article will state […]
1.Altium Designer. A new generation IC board-level design software, suitable for Windows XP system. It is the first software that integrated the design flow, PCB integration design, FPGA design of programmable devices, and embedded software based on processor design. it has all the functions needed to transform the design from concept to final product. 2.Cadence. […]
8.Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Compared with ENIG, the ENEPIG has added a layer of palladium between nickel and gold. Palladium can avoid the corrosion caused by the substitution reaction, and make full preparation for the immersion gold. Merits: Suitable for lead-free soldering. The surface is very smooth and suitable for SMT. Storage […]
7.Immersion silver Immersion silver is difficult between OSP and ENIG. Even when exposed to hot, wet, and pollution, silver can keep good weldability but will lose its luster. The I-Ag does not have the good physical strength of the ENIG, because there is no nickel below the silver layer. Merits: Simple process, suitable for lead-free […]
5.Immersion Tin(I-Sn) Due to all solders are based on tin, the tin coating can match any type of solder. The surface finish immersion tin can form a flat between copper and tin, this feature enables the sinter to have the same good weldability as the hot air leveling, without the headache of the unfitness in […]
4.Electroless Nickel/Immersion Gold (ENIG) The general process of ENIG is: Acid cleaning -> micro etching -> presoaking -> activation -> electroless nickel -> immersion gold.There are six chemical channels in the process, involving nearly 100 chemicals, and the process is a little complicated. The ENIG is coated with a thick and electrically nickel-gold alloy that […]
