The frequently-used units measurement in PCB design

The frequently-used units measurement in PCB design 1foot=12inch 1inch=1000mil 1mil=25.4um 1mil=1000uin 1um=40uin 1OZ=1ounce=28.35g/foot=35um Hoz=18um 4mil/4mil=0.1mm/0.1mm(line width and gap) 1ASD=1ampere/sqdm=10.76ampere/sqfoot 1AM=1ampere minute=60Coulomb 1sqdm=10.76sqFoot 1gallon(British system)=4.5litre 1gallon(American system)=3.785litre 1ampere hour=3600Coulomb baume degree=145-145/SG.(specific gravity) SG.(g/cube cm)=145/(145-baume degree) China PCB manufacturer factory supplier, printed circuit board, rigid PCB, flex-rigid PCB, Asia PCB,Chinese PCB, China PCB-Fabrik,Китайская фабрика печатных плат, Kiina PCB-tehdas, China fábrica de PCB,Çin PCB fabrikası, סין מפעל PCB  ...

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How to control the bow and twist of PCB?

The IPC-6012 provides max. bow and twist not exceed 0.75% for the PCB from SMB to SMT. This article will show you how to control the bow and twist of PCB.Let's find out the prevention methods of PCB bow and twist: Engineering design. The arrangement of PP between layers should correspond one-to-one;Core and PP should use the same brand products for mutilayer PCB. The inner and outer copper area should be close, and dummy copper can be added when necessary. Baking lamination before cutting. It is generally required to bake 150 degrees for 6 to 10 hours to remove moisture from the board and making the resin solidifies completely. Aligned the warp and weft of prepreg for mutilayer PCB. 4.Eliminate the stress after cold laminate and trim the deckle edge. 5.Baking the board before drill,150 degrees for 4 hours. 6.The thin PCB does not apply to the machine brush, recommended chemical cleaning. 7.After the HAL/LF-HAL, the...

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The factors affecting in PCB cost

We care more about layout and wiring during we design a PCB project,and often ignore the extra PCB manufacturing cost in the design.This article discusses which factors in the design affect PCB prices and avoid increasing costs to customers. 1.Number of layers.More layers more easy to layout, but the price increases with the number of layers, and the higher the layers, the higher the price. 2.Via hole.As far as possible use 0.25mm above, if the via hole diameter less than 0.25mm, most of manufacturers will collect extra cost. 3.Via in pad.Usually the manufacturer wants to increase the cost.Try not to use it unless the signal and layout are limited. 4.Back drilling.Back board and other high speed signal use, other do not use. Of course, there are many other factors that affect the cost of PCB, such as the material type (TG,halogen free and so on), copper thickness and surface treatment...

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Three difficult points in disposing high-concentration organic wastewater of PCB manufacturing

With the rapid development of China's economy, industry pollution is increasingly polluting the environment, government oversight is getting tougher for the standard discharge of waste water.It is imperative to recycle sewage. High-concentration organic wastewater was produced during PCB manufacturing,but there is no authoritative survey of pollutants in China so far. This article will state three difficult points in disposing high-concentration organic wastewater of PCB manufacturing. 1.The source of waste water is widely. High concentration of organic waste water will be produced in the process of developing and reproducing film, peeling of solder mask and acid degreasing. 2.The water quality of wastewater is complex and difficult to deal with. COD(ppm) >15,000,pH=9-12,Cu(ppm) <1,it is difficult to meet the standard of wastewater. 3.The high-concentration organic wastewater treatment process is more, the cost is higher. The high-concentration organic wastewater treatment technology in our country is not too developed at present stage, this virtually will increase the cost of the interprise's oporation,...

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Widely used softwares for PCB design

1.Altium Designer. A new generation IC board-level design software, suitable for Windows XP system. It is the first software which integrated the design flow, PCB integration design, FPGA design of programmable devices, and embedded software based on processor design. it has all the functions needed to transform the design from concept to final product. 2.Cadence.concept,allegro and orcad are all belong to Cadence.Cadence has introduced Orcad's strong schematic design capture CIS along with its original schematic design concept HDL,allegro and other signal simulation tools, collectively referred to as Cadence PSD, and is now called SPB. 3.Mentor. Mentor's products include EN, WG and PowerPCB. Mentor EN is its high-end professional schematic and PCB design software that supports both Unix and Windows systems.Mentor WG is its high-end PCB design tool based on the Windows interface. Its auto-routing function is very powerful and the layout rules are very professional. 4.Zuken.Zuken's high-end product is Cr5000...

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The merits and demerits of common surface treatment in PCB industry(ENEPIG)

8.Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Compared with ENIG, the ENEPIG is added a layer of palladium between nickel and gold. Palladium can avoid the corrosion caused by the substitution reaction, and make full preparation for the immersion gold. Merits: Suitable for lead-free soldering.The surface is very smooth and suitable for SMT. Storage conditions are not harsh.Suitable for electrical testing.Suitable for switch contact design.Suitable for aluminum wire binding, suitable for thick board, good resistance to environmental attack. Demerits: Higher cost. The changes of PCB surface finish typies are not very big, but we should be noted that the PCB surface finish will definitely change in the future,because of the tough environment and energy efficiency targets are getting more and more attention. China PCB manufacturer factory supplier, printed circuit board, rigid PCB, flex-rigid PCB, Asia PCB,Chinese PCB, China PCB-Fabrik,Китайская фабрика печатных плат, Kiina PCB-tehdas, China fábrica de PCB,Çin PCB fabrikası,...

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The merits and demerits of common surface treatment in PCB industry(I-Ag)

7.Immersion silver Immersion sliver is difficult between OSP and ENIG.Even when it exposed to hot, wet and pollution, silver can keep good weldability but will lose its luster.The I-Ag does not have the good physical strength of the ENIG, because there is no nickel below the silver layer. Merits: Simple process, suitable for lead-free soldering SMT.The surface is very smooth, low cost, suitable for fine lines. Demerits: Storage conditions are high and easy to pollute;Problems with welding strength (microcavity);It is easy to show the phenomenon of electrical migration and cavitating in the copper under the resistance welding film. China PCB manufacturer factory supplier, printed circuit board, rigid PCB, flex-rigid PCB, Asia PCB,Chinese PCB, China PCB-Fabrik,Китайская фабрика печатных плат, Kiina PCB-tehdas, China fábrica de PCB,Çin PCB fabrikası, סין מפעל PCB  ...

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The merits and demerits of common surface treatment in PCB industry(I-Sn and Hard Gold)

5.Immersion Tin(I-Sn) Due to all solders are based on tin, the tin coating can match any type of solder. The surface finish immersion tin can form a flat between copper and tin, this feature enables the sinter to have the same good weldability as the hot air leveling, without the headache of the unflatness in hot air leveling. The immersion tin PCB cannot be stored for too long and must be assembled according to the production time. Merits:Suitable for horizontal line production.Suitable for fine line processing, suitable for lead-free soldering, especially suitable for pressing technology.Very good flatness, suitable for SMT. Demerits:Good storage conditions, preferably not more than 6 months, to avoid tin whisker.Not suitable for contact switch design.In the production process, the resistance welding film process requirements are high, otherwise, it will cause the soldering film to fall off.Nitrogen gas protection is needed for multiple welding.Electrical testing is also a problem. 6.Hard gold,in order...

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The merits and demerits of common surface treatment in PCB industry (ENIG)

4.Electroless Nickel/Immersion Gold (ENIG) The general process of ENIG is: Acid cleaning -> microetching -> presoaking -> activation -> electroless nickel -> immersion gold.There are six chemical channels in the process, involving nearly 100 chemicals, and the process is a little complicated. The ENIG is coated with a thick and electrically nickel-gold alloy that could protect the PCB for a long period of time. It also has the tolerance to the environment that other surface treatment processes do not have. In addition, ENIG can also prevent the dissolution of copper, which will be beneficial to lead-free assembly. Merits: Not easy to oxidize, it can be stored for a long time, surface is smooth and suitable for welding fine gap pin and small welding parts. It is the preferred technology for pressing PCB boards (such as mobile phone boards). It can be repeated several times that reflow soldering is less likely...

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The merits and demerits of common surface treatment in PCB industry(OSP and flash gold)

2.Organic Solderability Preservatives(OSP) The general process of OSP process is: degreasing -> microcorrosion -> pickling -> pure water cleaning -> OSP coating -> cleaning.The process control is relatively easy to others. OSP is a process that meets the RoHS directive requirement for PCB surface finish. It has anti-oxidation, thermal shock and moisture resistance, which can protect the copper surface not rust (oxidation or vulcanization, etc.) in normal environment. Merits: The process is simple, the surface is very smooth, suitable for lead-free soldering and SMT;Easy to rework, easy to operate, suitable for horizontal line operation;Suitable for mixed surface finish (such as OSP+ENIG).Low cost and environmental friendly. Demerits: Limit of the times of reflow soldering (the OSP coating will be destroyed after multiple welding, basically 2 times is no problem);Not suitable for pressing technology and binding;Nitrogen is needed to protect in SMT.Not suitable for SMT rework.Storage conditions are more strict.   3.Flash gold Flash gold is a chemical deposition...

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