RCY ELECTRONIC :Rigid-flex PCB new product release ( III )

1   Product picture display   2 Application:control main board/  industrial control Laye count : 6L Thickness: 0.9mm Copper Thickness: 1/2OZ Min. hole size: Laser via 0.1mm Surface finish: ENIG process difficulties: HDI,POFV process, multi-zone FPC opening technical Stack-up diagram:   3  Manufacturing flow: Main flow FCCL Cutting->Drilling->Inner circuit->Coverlay->Brown Oxide->Bonding->laminating ->Laser drilling->Hole PTH Outer circuit->Pattern PTH->Etching->solder mask->Mechanical cover-opening->Immersion gold->FPC UV lasering->E-TEST->Outline->FQC 4  Process difficulties: 1)  Thick copper (copper thickness 1OZ) NF PP pressing process to solve the problem of pressing thick copper filling. What's more, we used dispensing process, need to solve high temperature assembly, and soft and hard board bending softness. In addition, we offered material selection  to use high reliability 3M AB glue to produce 2) Hard and hard plate HDI hole filling process, resin plug hole POFV process, soft and hard board due to uneven surface structure. Besides, there is need to solve the selection of laser blind hole processing, DLD or conform mask. And also , we used resin plug brush reduction process. 3) Moreover, we applied multiple sets of differential,...

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RCY ELECTRONIC :Rigid-flex PCB new product release ( II)

1   Product picture display 2 Application:industrial camera/Industrial control layer count :12L Thickness:1.6 mm Copper Thickness:1OZ(CU35/PI100) Min. hole size:0.2 mm Surface finish:ENIG process difficulty:metal groove on the side, high and multilayer Stackup Stack-up diagram: 3  Manufacturing flow: Main flow FCCL Cutting->Drilling->Inner circuit->Coverlay->Brown Oxide->Bonding->laminating ->Panel PTH-> outer circuit->pattern PTH->Etching>solder mask->Immersion gold->FPC UV lasering->E-TEST->Outline->FQC   4  Process difficulties: a. Material selection, industrial control, use DuPont AP series material PI 100um, copper thickness 35um; high TG NF PP + core board material selection. b. High multi-layer NF PP pressing process, NF PP thick copper pressure-filling process, open cover structure design. c. Multiple sets of differential, single-ended impedance process design; different layers of soft board and hard board impedance design. d. The side metal groove process uses an alkaline etching process to improve the metal burr problem. e. Solder-resistant black oil dense BGA (0.25mm) process. f. Positive and negative laser + mechanical control deep processing, to meet the thick cover open cover design   5  Product application : Industrial camera vision system for HD, precision, dynamic image acquisition and intelligent identification...

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RCY ELECTRONIC :Rigid-flex PCB new product release ( I )

1 Product picture display 2 Product features Application:Blue Tooth Earphone/Consumer Electronics Layer count :6L Stack up:2R+2F+  2R Thickness:0.8mm Copper Thickness:1/3mm Min. hole size:Blind Via 0.1mm Surface finish:ENIG process difficulty:HDI Stack-up diagram:   3  Manufacturing flow: Main flow FCCL Cutting->Drilling->Hole blacking->PTH->Inner circuit->Coverlay->FPC MASK->Brown Oxide->Bonding->laminating ->X-Ray drilling-> Hole Plating->resin plug hole ->outer circuit->solder mask->rigid flex opening>Immersion gold->Bonding->FPC UV lasering->E-TEST>outline>FQC   4  Process difficulties: The inner soft board anti-welding process.In addition, the inner soft board window Cover lays the tolerance, which needs to be made of soft board anti-welding ink. However, the process needs to consider the external lamination heat and stress after the anti-welding. And realize the inner layer soft plate gold process design 2. In addition, HDI blind hole design, using first-order HDI+VOP process, laser hole filling after laser blind hole, resin plug hole process. What's more ,to meet the requirements of product design signal stability 3. Moreover,  the resistance requirements, product design has a conductive network requirement for steel sheet and FPC. However, low resistance value and stability requirements are achieved through material selection...

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5G will change the category requirements structure of PCB

5G is coming soon China's current 5G testing and pilot work is progressing smoothly.China Mobile, China Telecom and China Unicom's three major operators have similar 5G development plans. In 2018, they will continue to expand the scale of field trials  and in 2019, they will conduct commercial trials and formally commercialize them in 2020.And also,with the development of 5G, the PCB category demand structure will also change, there will be an increase the demand for high value-added PCB products such as high-speed high-frequency multilayer boards, HDI, and flexible boards. On one hand, 5G pulls the base station scale and the consumables to grow, PCBs are commonly used in antennas for antenna modules, communication backplanes, power amplifiers, low noise amplifiers, filters, and more. On the other hand,in the 5G era, with the technical requirements of high frequency, high speed and high data volume, many of the original low and medium frequency communication materials will be eliminated, and the PCB is irreplaceable due...

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Automotive PCB Supplier : 5G mobile phone shipments will exceed 4G smartphones ,accounting for above 50% In 2023,

 on July 8,according to foreign media reports, market research firm Canalys predicts that by 2023, shipments of 5G-enabled mobile phones will reach nearly 800 million units, accounting for 51.4% of total smartphone shipments which means that 5G smartphones shipments will exceed 4G smartphones after 5 years of global 5G commercial. However, the market research organization said that between 2019 and 2023, the compound annual growth rate (CAGR) of 5G smartphone shipments will reach 177.9%, and mobile phone vendors will deliver nearly 19 billion 5G smart phone to the market by the end of 2023. Canalys said that by 2023, 5G smartphone shipments in Greater China will account for 34.0% of the world, North America will account for 18.8% of the world, and Asia Pacific will account for 17.4% of the world. Analysts said, "There is no doubt that Huawei, OPPO, Xiaomi and ZTE will become operators' 5G smartphone partners. At the same time, South Korea's...

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Flex rigid PCB factory : the practical knowledge you have to know about PCB Layout ( Two )

As we all know, when we do PCB layout, there are always some tips and ideas that we can follow to save our time and effort. Now let's continue  to talk about the ideas and principles on PCB layout 8.  when we design PCB layout, we should keep  high current, high voltage, strong radiating components away from weak current, low voltage, sensitive components   9. Analog circuits , digital, power, and protection circuits should be  separated   10. The interface protection device should be placed as close as possible to the interface   11. The layout of the switching power supply should be compact, the input and output should be separated, and the layout should be strictly in accordance with the requirements of the schematic. In addition, do not place the capacitance of the switching power supply at will.     12. What's more, we should also take Capacitor and filter into account when we do PCB layout 1) The capacitor must be placed close to the...

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the practical knowledge you have to know about PCB Layout ( One )

When we analyze the whole circuit principle, we can start to lay out the entire circuit. Today let's talk about the  ideas and principles of PCB layout 1. First, we will place the components and parts with the required structure. When placing it, according to the imported structure, the connector should pay attention to the position of the 1 pin 2. Pay attention to the height limit requirement in the structure when laying out the layout   3. If we want the layout to be pleasing to the eye,it is usually positioned by the outer frame or centerline coordinates (centered alignment). 4. Overall layout should consider heat dissipation 5. When laying out , you need to consider the routing channel evaluation and consider the space required by the equal length.   6 we also need to  consider electric current of power flow and evaluate the power channel 7. High-speed, medium-speed, low-speed circuits must be separated     Summary In the meanwhile, SHENZHEN RENCHUANG YI ELECTRONIC CO.,LTD ( Short as RCY ELECTRONIC) is a professional...

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Analysis of the FPC business development of smart phone

Flexible printed circuit (FPC) is extensively  used in smartphones to connect parts and motherboards, such as display modules, fingerprint modules, camera modules, antennas, vibrators, etc.With the continuous penetration of fingerprint recognition, the upgrade of the camera to dual-camera, and the use of OLED, FPC usage in smartphones will continue to increase With the gradual popularization of dual-camera and three-camera, the future growth of camera modules is still relatively large. we expect that it reach 45% in 2019. Huawei mobile phone is a strong promoter of dual-camera. In 2017, dual-camera shipments accounted for more than 50%. , vivo, Apple followed However,according to survey data, 2017 CMOS image sensor sales reached 11.5 billion US dollars (+9%), 2016 ~ 2021, CMOS image sensor market size compound annual growth rate of about 8.7%   At the same time, with the release of Huawei and Samsung foldable mobile phones, future foldable mobile phones will push up the demand for flexible AMOLEDs. According to the survey data,...

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Knowledge that purchasers must know about printed circuit boards !

As we all know,the printed circuit boards used in actual electronic products vary widely. However, according to different types, printed circuit boards have different classifications, details are as following 1  according to the layer count of  printed circuit boards • Single-sided PCBs single layer PCB is a printed circuit board that has only one layer of circuit and one layer of solder mask, and normally,  the substrate of single layer PCB has thickness of 0.2 mm-5 mm, single layer PCBs are simple to manufacture, easy to assemble,suitable for electronic products with a single circuit such as radio, TV, etc. Besides, single layer PCBs are not suitable for applications requiring high assembly density or complex circuits   • Double-sided PCBs Double layer PCBs are a printed circuit board that has two layers of circuit and  solder mask, usually, it's top layer and bottom layer on both sides of PCBs In addition, double-sided PCBs are suitable for general requirements of electronic products such as electronic computers, electronic instruments and meters Since the wiring density of double-sided PCBs...

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What is the PCB manufacturing process? ( Part 2)

Solder mask : In this step, we apply a layer of green ink in the place where it is not welded. In addition, we finish this step by coating with green ink under the screen printing process,as shown below Silk Screen: characters and legends,like component label, LOGO, and symbols in the Gerber file are printed on the surface of the PCB board by screen printing method   Surface Treatment This step is to do some processing on the pad or on the PCB surface to prevent copper from oxidizing in the air. Besides, we can do surface finishing as following : HASL/LF-HASL,Gold Finger,Hard Gold,OSP,Immersion Gold,Immersion Tin,Immersion Silver What's more, we can also make according to customer's requirements   E-TEST->FQC->Packing After all  above manufacturing process, a PCB board now is completed. However, the PCB boards we finished need to do E-TEST to check whether  there is a short circuit or open circuit for PCB,it will be tested in an electric testing machine   To sum up: As we can see, PCB manufacturing/PCB production/PCB fabrication process...

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Shenzhen Renchuangyi Electronics Co., Ltd
Tel: 0755-27314226
Address:
Building 4, JinFeng Industry Zone, Heping Village, Fuyong Town, Bao’an District, Shenzhen, Guangdong Province, PRC.:
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