Category Archives: Capabilities

Quick Turn | Prototype Quantities | Production Quantities | 2 – 32 Layers | 12:1 Drill Aspect Ratio | Blind / Buried Vias | Via In Pad with Fill Options | Controlled Impedance | High Copper Thickness.

Rigid-flex pcbs Technical Capabilities

Max Panel Size: 10″*20.5″(250mm*520mm) Min Inner layer line width/space: 3mil/3mil(0.075mm/0.075mm) Min lnner Layer Pad: 3mil(0.75mm) Min Core Thickness: 2mil(0.05mm) Inner Layer Copper Thickness: 0.5-1 oz Finished Copper Thickness: ⅓-4 oz Final Board Thickness: 0.3-3.2mm Final Board Thickness Tolerance: ±10% Layer Count: 2–16 Inner layers Registration: ±2mil(±50um) Min mechanical Drill Size: 0.15mm Hole Position Accuracy: ±2mil(±50um) […]

FR4 Technical Capabilities

Max Panel Size: 25″*20.5″(622mm*520mm) Min Inner layer line width/space: 3mil/3mil(0.075mm/0.075mm) Min lnner Layer Pad: 4mil(0.1mm) Min Core Thickness: 4mil(0.1mm) Inner Layer Copper Thickness: 0.5-8 oz Finished Copper Thickness: 0.5-20 oz Final Board Thickness: 0.4-3.2mm Final Board Thickness Tolerance: ±10% Layer Count: 2-26 L Inner layers Registration:±2mil(±50um) Min mechanical Drill Size: 0.15mm Hole Position Accuracy: ±2mil(±50um) […]