Development of Flex PCB (FPCs) and substrate-like pcb (SLPs) in PCBs
Nowadays, as we all know, the development of mobile phones is becoming more and more intelligent, thin and light
which means that the internal components of mobile phones will be further reduced or integrated.
Under this trend, flex pcb (FPCs) and substrate-like pcb (SLPs) in PCBs have the opportunity to be further promoted and applied.
At present, FPC has grown to RMB 31.6 billion in the Chinese market. It is estimated that by 2021, China’s FPC market will have an opportunity to reach RMB 51.6 billion
with a compound annual growth rate of 10%. And today’s mainstream Chinese brands of mobile phones use FPCs in 10 to 15 pieces,while iPhone X uses up to 20 to 22 pieces.
We can see that there is still much room for improvement in the use of FPCs in Chinese smartphones market.
At the same time, the FPC single value has reached 10 US dollars, the amount is still rising.
However, FPCs are used extensively in smartphones for connections between components and motherboards,
such as display modules, fingerprint modules, lens modules, antennas, vibrators, and more.
With the penetration of fingerprint recognition, the lens from the dual lens to the three lenses, and the use of OLED, the use of FPC will continue to increase
Due to the trend of intelligent, miniaturized and diversified electronic products such as smart phones, tablets and wearable devices
the number of components that need to be mounted on the PCB has increased significantly
but the required size, weight and volume have been shrinking
PCB highest process: SLPS
martphones have evolved from 4G LTE to 5G,and the complexity of Massive MIMO antenna configurations has made
RF front-ends take up more space in 5G smartphones. In addition, the amount of data processed by the 5G system will grow geometrically
which will increase the battery capacity requirements. And that means PCBs and other electronic components
must be compressed to achieve higher density and smaller form factor.