Lamination
1.Concept
Bonding a plurality of cores with circuit patterns through the prepreg (PP) under the condition of high temperature and pressure

2.Main materials involved in the Inner layer

1)Copper Clad Laminate( CCL) with circuit patterns
2)prepreg (PP)
3)Copper foil

3.Process flow

1)The purpose of Browning : to clean the board surface and roughen the copper surface to increase adhesion
2)The purpose of prestack : to Stack a plurality of Copper Clad Laminate( CCL) with circuit patterns and PP together according to layers
3)The purpose of hot melting: Multi-layer boards that are stacked together are pre-fused together by high-temperature preheating (board edge fusion) to reduce the offset between layers
4)The purpose of the pre-arrangement: Multiple pre-fusion plates and copper foil are juxtaposed on the tray of the pressing machine
5)The purpose of pressing or laminating :fully bonding the patterned copper clad laminate and PP together by high temperature and high pressure
6)X – RAY drilling targets: the inner layer positioning hole is drilled by laser irradiation to facilitate CNC drilling positioning

4.Advantages

1)Can produce up to 32L board
2)CCD Hot melting Machine: Minimum alignment accuracy between layers is 2mil
3)Typesetting line: fully automatic cutting copper foil, the thinnest copper foil that we can produce is one-third oz
4)Pressing Machine :has a very high level of flatness, high temperature uniformity, the highest temperature can reach 280 ° C
5)X – RAY drilling targets accuracy is 2 mil

Shenzhen Renchuangyi Electronics Co., Ltd
Tel: 0755-27314226
Address:
Building 4, JinFeng Industry Zone, Heping Village, Fuyong Town, Bao’an District, Shenzhen, Guangdong Province, PRC.:
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