Rigid-flex pcb production


1.Definition of Rigid-flex PCB


The birth and development of FPC and PCB have created this new product- Rigid-flex PCB board Therefore, it is a printed circuit board, which combines a FPC( flexible printed circuit) with a rigid circuit board by pressing or laminating processes, and according to the relevant technological requirements to form a circuit board having FPC characteristics and PCB characteristics.

1)LED Rigid-flex pcb
2)4L Rigid-flex pcb
3)4L Rigid-flex pcb


2.Common Rigid-flex PCB stack-up structure

1)Single FPC stack-up structure
2)Multi-layer Rigid-flex PCB structure
3)AIR GAP structure
4)FPC in the outer layer
5) Book structure


3.Key process flow of Rigid-flex PCB production



1)FPC production


Purpose of cutting:Cut the flex pcb material (FCCL/cover film/pure rubber, etc.) into PNL size we need for pcb processing
Purpose of FPC LAMINATOR : Pressing the FPC board together with a certain temperature and pressure through a Bonding sheet to form a FPC layer stack
Purpose of blacking the hole : Through the black hole method, a layer of charged carbon powder is attached to the wall of the hole to realize metallization of the hole wall for subsequent copper plating.
Purpose of FPC Board plating: To make the hole wall plate with a standard copper thickness to achieve electrical signal conduction between layers
Purpose of FPC exposure : To achieve FPC graphic image transfer through dry film/exposure principle
Purpose of FPC etching: Acid etching is used to achieve the removal of FPC pattern of copper layer
Plasma degumming: mixing a certain proportion of gas in a vacuum chamber to achieve a vacuum plasma state to meet the purpose of soft board removal or film surface roughening


2)pressing or laminating process


Stick covering film : protect the copper surface of the FPC board substrate and increase the folding resistance of the FPC board
The purpose of fast laminating : pressing the film at a high temperature for a short period of time, bonding the cover film to the copper surface of the FPC board substrate to enhance the viscosity of the cover film and the FPC board
The purpose of Browning : to roughen the surface of the copper through chemical syrup to increase the bonding force between the FPC board and the rigid board.
The purpose of pressing or laminating : bonding the FPC boards and the rigid boards together by high temperature and high pressure


3)Opening process


Purpose of Core board : through the UV laser to control the deep Core board, and the outer layer control depth to form the opening section, to achieve the opening design
Purpose of Routing opening slot : through mechanical forming, form a closed path with the outer layer to achieve the opening design
Laser depth control: open the cover of the thin cover sheet by UV laser depth control
Mechanical control depth: through the mechanical control depth, the outer cover of the thick cover piece is realized.


4.The advantage of our factory to produce Rigid-flex PCB board


1)More than 20 years of PCB manufacturing experience, with over 5 years of experience in Rigid-flex PCB production
2)Advanced CCD hot melt equipment and automated laminating equipment, Strong manufacturing process capability of laminating
3)LDI can produce printed circuit boards with 30/30um trace width & trace spacing, precise alignment accuracy
4)Plasma and browning process can increase the bonding between FPC and Rigid pcb boards
5)With UV cutting, we can deliver quickly
6)Unique technical advantages in the opening process





Shenzhen Renchuangyi Electronics Co., Ltd
Tel: 0755-27314226
Building 4, JinFeng Industry Zone, Heping Village, Fuyong Town, Bao’an District, Shenzhen, Guangdong Province, PRC.:
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