FR4 Technical Capabilities

FR4 Technical Capabilities

Max Panel Size: 25″*20.5″(622mm*520mm)
Min Inner layer line width/space: 3mil/3mil(0.075mm/0.075mm)
Min lnner Layer Pad : 4mil(0.1mm)
Min Core Thickness : 4mil(0.1mm)
Inner Layer Copper Thickness :0.5-8 oz
Finished Copper Thickness :0.5-20 oz
Final Board Thickness :0.4-3.2mm
Final Board Thickness Tolerance :±10%
Layer Count :2-26 L
Inner layers Registration :±2mil(±50um)
Min mechanical Drill Size :0.15mm
Hole Position Accuracy :±2mil(±50um)
Hole Diameter Tolerance :±2mil(±50um)
Max PTH Aspect Ratio :10:01
Image To Image Tolerance :3mil/3mil(75um/75um)
Min Out layer line width/space :3mil/3mil(88um/88um)
Etching Tolerance :±10%
Min Solder mask Dam :4mil(100um)
Max Solder Mask Plug Hole Diameter :0.5mm
Surface Treatment :HASL,Gold Finger,Plating Gold,OSP,ENIG,IMM,TIN,IMM AG
Max Gold Thickness Of Gold Finger :≤30u”(≤0.75um)
Gold Thickness Of Immersin Gold :AU 1-3u”(0.025-0.075um)
Impedance Control And Tolerance :±10%
Peel Strength :≥61B/in(≥107g/mm)
Warp And Twist :≤0.75%

***** We are among the top 100 PCB and Rigid-Flex PCB manufactures in China.
With perfect management system and high standard manufacturing process.
The product quality in our factory is trustworthy *****

Jason