Max Panel Size: 25″*20.5″(622mm*520mm)
Min Inner layer line width/space: 3mil/3mil(0.075mm/0.075mm)
Min lnner Layer Pad: 4mil(0.1mm)
Min Core Thickness: 4mil(0.1mm)
Inner Layer Copper Thickness: 0.5-8 oz
Finished Copper Thickness: 0.5-20 oz
Final Board Thickness: 0.4-3.2mm
Final Board Thickness Tolerance: ±10%
Layer Count: 2-26 L
Inner layers Registration:±2mil(±50um)
Min mechanical Drill Size: 0.15mm
Hole Position Accuracy: ±2mil(±50um)
Hole Diameter Tolerance: ±2mil(±50um)
Max PTH Aspect Ratio: 10:01
Image To Image Tolerance: 3mil/3mil(75um/75um)
Min Out layer line width/space: 3mil/3mil（88um/88um）
Etching Tolerance: ±10%
Min Solder mask Dam: 4mil(100um)
Max Solder Mask Plug Hole Diameter: 0.5mm
Surface Treatment: HASL,Gold Finger,Plating Gold,OSP,ENIG,IMM,TIN,IMM AG
Max Gold Thickness Of Gold Finger: ≤30u”（≤0.75um）
Gold Thickness Of Immersion Gold: AU 1-3u”(0.025-0.075um)
Impedance Control And Tolerance: ±10%
Peel Strength: ≥61B/in（≥107g/mm）
Warp And Twist: ≤0.75%
