global IC packaging market will exceed 10 billion US dollars in 2022
The IC package substrate, also known as the IC carrier board, is directly used to carry the chip,
which not only provides support, protection and heat dissipation for the chip, but also provides an electronic connection
between the chip and the PCB motherboard. It is estimated that the global IC packaging materials market reached 20 billion US dollars in 2018,
the largest proportion of which is IC package substrate, about 7.3 billion US dollars.
The global IC packaging substrate market is growing steadily, and will break $10 billion by 2022.
The IC packaging market has been in a stable growth stage in recent years. At present, the global package substrate market is basically occupied by PCB companies such as UMTC, Ibiden, SEMCO, South Asia circuit board, Kinsus and other regions in Japan, Taiwan, South Korea, etc. The market share of the top ten companies is over 80%, and the industry concentration is relatively higher
However, PCB companies from China’s mainland have been still in the early stage of development and growth, most of them are engaged in the production of low-end and medium-end PCB products, and they do not have the conditions to enter the IC packaging industry, only a few leading PCB companies from China’s mainland are able to begin developing and mass production of IC package
China’s IC package market capacity does not match the IC package output of local enterprises, and there is a huge potential for localization of IC package
In 2017, the total production output of IC packaging in China’s market reached 1.14 million square meters.
Also, it is expected to increase to 1.94 million square meters by 2025,
At present, the mainstream IC package products in China are FC CSP, FC BGA and WB BGA/CSP.
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