High frequency PCB process capability

Item Technical specificationTechnicalILLUSTRATION

Base Material

PTFE, hydrocarbon, resin, other types

PTFE + ceramic,
PTFE + glass fiber + ceramic, PTFE + glass fiber
HF 1 - High frequency PCB process capability

Layer

Layer Count

16 L
HF 3 - High frequency PCB process capability
Shape toleranceMax.panel size720*650 mm
Shape tolerance
±0.10 mm
Hole size toleranceOrdinary hole ±0.1; Short hole ±0.13

Pressing ability

Interlayer alignment accuracy

3 mil
5 2 - High frequency PCB process capability
Pressing and mixing capacityPTFE+hydrocarbon ceramics+Fr4
Hole processing technologyMin Hole Diamete0.3 mm
Minimum hole wall spacing0.65mm

Hole Diameter Tolerance

±0.075 mm
HF 5 - High frequency PCB process capability

Plating capacity

Max. aspect ratio

12:1
6 1 - High frequency PCB process capability
Hole copper uniformityCOV≤7%
Resin plug holeResin plug hole aspect ratio
12:1

Hole processing type

Through hole/blind buried hole
HF 3 1 - High frequency PCB process capability

Line width control

Line width tolerance

±1.5mil
3 1 - High frequency PCB process capability

Impedance Control

Impedance Control Tolerance

±10%
8 - High frequency PCB process capability
Warp and TwistWarp and Twist0.75%

Special process
POFV (VIPPO), mixed pressure, partial mixed pressure, length/grading/segment gold finger, step groove, back drill, sidewall metallization, N+N structure, double-sided crimping mechanical blind hole, local thick copper, high temperature Pressing, copper paste/silver paste plug hole, skip holeHF 41 - High frequency PCB process capability

Material
Material Cooperative Brand
Shengyi (LNB33), Lianmao, Taiyao, Panasonic (M4, M6 series)

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