Application of Plasma Surface Pretreatment in PCB Manufacture Process

China plays an important role in PCB manufacturing in the world. In recent years, the global status of PCB manufacturing has tremendous change, and most PCB manufacturing has transferred to Asia, especially China. China has become the main PCB supplier of the world. In the premise that electronic products tend to be more complex, the precision and quality requirements of PCB are also more strict. With the popularization of Plasma surface treatment technology, PCB manufacturing technology has been innovated greatly. The main functions of Plasma are as following: Hole wall erosion, scraps removing. Plasma is good for obtaining a better roughness of the hole wall and helpful for the metallization of the hole.PTFE material activation treatment.

 

China plays an important role in PCB manufacturing in the world. In recent years, the global status of PCB manufacturing has tremendous change, and most PCB manufacturing has transferred to Asia, especially China. China has become the main PCB supplier of the word. In the premise that electronic products tend to be more complex, the precision and quality requirements of PCB are also more strict. With the popularization of Plasma surface treatment technology, PCB manufacturing technology has been innovated greatly. The main functions of Plasma are as following:

Hole wall erosion, scraps removing.

Plasma is good for obtaining a better roughness of the hole wall and helpful for the metallization of the hole.

PTFE material activation treatment.

Plasma is easy to operate and keeps stable/reliable quality, it’s suitable for mass production very much.

Carbide removing.

Plasma is useful to remove drilling dirt, especially for complex resin material and micro via. The Carbide is produced by laser drilling, it must be removed before the hole metallization process. The plasma treatment technology is the first option for carbide removal.

Inner layer pretreatment.

For the Flex and Flex-rigid PCBs, Plasma can increase the roughness and activity of the surface and increase the bonding of the inner layers, it’s a key process for successful manufacture. Moreover, applying Plasma before sold mask printing is able to improve the adhesion of the sold mask.

Residues removing.

In the PCB manufacture process, especially the fine-line products, the Plasma is useful to remove dry film residues and scumes, etc. before etching to obtain a perfect high-quality wire pattern.

For other special base materials, Plasma could avoid the particles on the copper surface, to easily achieve the qualified products.