About Printed Circuit Board (PCB)
PCB, also known as a printed circuit board. It is the support of electronic components and the carrier of electrical connections of electronic components. The traditional circuit board uses the method of printing etching resist to make the circuit lines and drawings, so it is called a printed circuit board or a printed circuit board.
The circuit boards we usually see are soldered with components on the basis of the PCB, namely PCBA (PCB Assembly), and the PCB is a “bare board” or “light board”, that is, the PCB is a circuit board without soldering components. , PCB and circuit components are formed into circuit boards actually used in electronic products after the process of assembly.
The origin and development history of PCB
01 The history of PCB development in the world
In 1936, Austrian Paul Eisler, the creator of printed circuit boards, first used printed circuit boards in radio devices.
In 1943, Americans mostly used this technology in military radios.
In 1947, the American Aviation Administration and the American Bureau of Standards initiated the first PCB technical seminar.
In 1948, the United States officially recognized this invention and used it for commercial purposes.
In the early 1950s, due to the problem of the adhesive strength and solder resistance of CCL’s copper foil and laminates was solved, the performance was stable and reliable, and large-scale industrial production was realized. The copper foil etching method became the mainstream of PCB manufacturing technology and began to produce single panels.
In the 1960s, large-scale production of double-sided PCBs with hole metallization was realized.
In the 1970s, multi-layer PCBs developed rapidly and continued to develop in the direction of high-precision, high-density, fine-line small holes, high reliability, low cost, and automated continuous production.
In the 1980s, surface mount printed boards (SMT) gradually replaced plug-in PCBs and became the mainstream of production.
Since the 1990s, surface mounting has further developed from a flat package (QFP) to a ball grid array package (BGA).
Since the beginning of the 21st century, high-density BGA, chip-scale packaging, and multi-chip module package printed boards with organic laminate materials as substrates have been rapidly developed.
02 History of PCB Development in China
In 1956, China started PCB research and development.
In the 1960s, single-sided boards were produced in batches, double-sided boards were produced in small batches, and multilayer boards were developed.
In the 1970s, due to the limitations of historical conditions at that time, the development of printed board technology was slow, making the entire production technology lagging behind the advanced level of foreign countries.
In the 1980s, advanced single-sided, double-sided, and multilayer printed board production lines were introduced from abroad, which improved the production technology level of printed boards in my country.
In the 1990s, Hong Kong, Taiwan, Japan, and other foreign printed board manufacturers have come to China to set up joint ventures and wholly-owned factories, which has enabled Chinese printed board output and technology to advance by leaps and bounds.
In 2002, China became the third-largest PCB producer.
In 2003, PCB output value and import and export value both exceeded US$6 billion, surpassing the United States for the first time, becoming the world’s second-largest PCB producer. The proportion of output value has also increased from 8.54% in 2000 to 15.30%, an increase of nearly double.
In 2006, China replaced Japan as the world’s largest PCB production base and the most active country in technological development.
In recent years, the Chinese PCB industry has maintained a rapid growth of about 20%, which is far higher than the growth rate of the global PCB industry.