Rigid PCB Process Capability

ItemTechnical specification Illustration

Layer Count

1-32 L
1 2 - Rigid PCB Process Capability
Base MaterialFR4 (TG135/TG150/TG170/CAF/CTI>600/halogen/halogen free)
Max.panel size850mm*520m

Final Board Thickness

0.25mm-7.0mm
2 1 - Rigid PCB Process Capability

Tolerance of Final Board Thickness

± 10%(Thickness>1.0mm) ; ±0.1mm(Thickness<1.0mm)
3 1 - Rigid PCB Process Capability
Min line Width/Space3mil/3mil(75um/75um)

Min hole to line Spacing

5mil(125um)for 2L,6mil(150um)for 4L,7mil(178um)for 6L and above
4 1 - Rigid PCB Process Capability
Minimum BGA clamping line3.5mil(89um)
Copper thickness⅓ - 4 oz(Inner Layer) ; ⅓ - 8 oz(Outer Layer)

Inter-layer alignment accuracy

2mil/2mil(50um/50um)
5 2 - Rigid PCB Process Capability
Min Hole Diamete≥0.15mm( Mechanical hole);≥0.10mm( Laser hole)
Hole Diameter Tolerance±0.075 mm(3mil)

Aspect ratio

12:1
6 1 - Rigid PCB Process Capability
Etching Tolerance±10% / ±1.5mil
Solder Mask Thickness≥1mil(≥25um)

Min Solder Mask Bridge

4mil (100um)
7 - Rigid PCB Process Capability
Solder Mask Plug Hole Max Diameter0.6 mm
Surface TreatmentHASL/LF-HASL,Gold Finger,Hard Gold,OSP,Immersion Gold,Immersion Tin,Immersion Silver
Gold Thickness1-3u"( Immersin Gold) ;≤50u"(Hard Gold)

Impedance Control Tolerance

±10%
8 - Rigid PCB Process Capability

Warp and Twist

≤0.5%
9 1 - Rigid PCB Process Capability
Peel strength≥107g/mm

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