The development trend of PCB technology

PCB products, whether rigid PCB, flexible PCB, rigid-flex PCB, multi-layer PCB, and module substrates for IC package substrates, make a significant contribution to high-end electronic equipment. PCB industry plays an important role in electronic interconnection technology.

This article makes the following analysis on the current development trend of PCB technology:

1. Development towards the road of high-density interconnect technology (HDI)

Since HDI PCB can embody the most advanced technology of the current PCB industry, it brings fine wire and micro-aperture to the PCB. HDI multi-layer PCBs are widely applied in terminal electronic products – cellphone (mobile phone)

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2. Component embedding technology has strong vitality

The component embedding technology is a PCB functional integrated circuit. what Great changes, but it is imperative to develop analog design methods, production techniques, and inspection quality and reliability.

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3. PCB material development needs to be a higher level

Whether it is a rigid PCB or a flexible PCB material, as global electronic products are lead-free, in the meantime, it is required to make these materials more resistant to heat. Therefore, the new high Tg, small thermal expansion coefficient, small dielectric constant, and excellent materials need to keep appearing

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4. Photovoltaic PCB has broad prospects

As we know, it uses the optical path layer and the circuit layer to transmit signals. The key to this new technology is the fabrication of optical path layers (optical waveguide layers), and also, it is an organic polymer formed by lithographic photolithography, laser ablation, reactive ion etching, and the like. At present, the technology has been industrialized in Japan, the United States.