Bluetooth earphone board

Layers: 6L
Stack-up:2R+2F+2R
Thickness: 0.6mm
Out layer Copper Thickness: ⅓ OZ
Inner Layer Copper Thickness: ⅓ OZ
Min hole size: 0.2mm
Min Line Width/Space: 3mil
Surface finish: ENIG
Application: JBL Headset
Features: high quality of impedance matching

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