Bluetooth rigid flex boards

Layers:   6L

Stack-up:1+(1-2F-1)+1

Thickness: 1.0mm

Out Layer Copper Thickness: 1 OZ

Inner Layer Copper Thickness:1 OZ

Min hole size:0.3mm

Min Line Width/Space:  3mil

Surface finish: ENIG

Application: TWS Bluetooth headset

Features: HDI structure

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