1) FPC process: Flex Board Cutting→Drill Locating Hole→Image→AOI→Cover Film→Lamination
2) Rigid PCB: Rigid Board Cutting→Drill Locating Hole→Rigid Board Pre-treatment
3) Main process: Rigid-Flex Fusion→Drilling→PTH→Outer Layer→Outer Layer AOI→Solder Mask→Finishing→Screen→Gong Open Lid→Routing→E-Tes→FQC→Packaging
The outside structure of flexible board:
The feature of this structure is that the outer side of the flexible board can realize special bending and design.
The width of the flexible board area is only 2mm, and it is difficult to open the cover. By optimizing the PP shrinkage compensation, the narrow flexible board bending design can be realized. The flexible board area is filled with high-temperature materials to isolate and fill the gap caused by the PP window so that the laminated board has a good flatness.
The outer structure of the flexible board is laminated with high TG No Flow PP, and the laminated is filled with three-in-one auxiliary materials + aluminum sheet. It has better interlayer adhesion and flatness of soft board surface.
The surface treatment method of the flexible board is solder mask and cover film. This process is optimized for the flexible board area to paste the cover film first, and then the rigid board area solder mask. The solder mask requires a special printing method to meet the ink uniformity.
The lid opening method, laser anti-control + mechanical forward control, make it have a better appearance of rigid and flexible handover.