1.Laminated structure
2.Production Process
1) FPC process: Flex Board Cutting→Drill Locating Hole→Image→AOI→Cover Film→Lamination
2) Rigid PCB: Rigid Board Cutting→Drill Locating Hole→Rigid Board Pre-treatment
3)Main process: Rigid-Flex Fusion→Drilling→PTH→Outer Layer→Outer Layer AOI→Solder Mask→Finishing→Screen→Gong Open Lid→Routing→E-Tes→FQC→Packaging
3. Process difficulties:
HDI+ symmetrical structure, fixed-depth drilling, nickel-palladium-gold process, multiple impedances.
The characteristics of this structure are: Flexible board is outside
