Lens module board

Layers  :   4 L
Stack-up : 1 R+2 F+1 R
Thickness :  0.3 mm
Out Layer Copper Thickness: 1 OZ
Inner Layer Copper Thickness: 1 OZ
Min hole size : 0.15 mm
Min Line Width/Space : 3 mil
Surface finish : ENIG
Application : Camera module / Industrial camera
Features : super-thin rigid-flex pcb

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