1. Laminated structure
2. Production process
Flexible board cutting → drilling → black hole VCP → line etching → AOI scanning → pressing and covering film → pressing → drilling → sinking copper board electricity → resin plug hole → sinking copper board electricity → outer circuit etching (alkaline etching) →AOI scanning→welding mask character→immersion gold→open lid forming→laser depth control→electrical measurement→rigid board forming→flexible board forming→FQC→packaging
3. Manufacturing difficulties
4. Application areas
This rigid-flex board is used in Bluetooth headsets. The flexible board area is the location of the antenna, which is mainly used to transmit signals, and the middle rigid board area is mainly used to mount components. The outermost part of the rigid board has a large area of immersion gold, which is mainly used for heat dissipation.