1. Laminated structure
2. Production process
Flexible board cutting → drilling → black hole VCP → circuit etching → AOI scanning → pressing and covering film → pressing → laser drilling → drilling → electroplating and filling hole → sinking copper plate electricity → outer circuit etching (alkaline etching) →AOI scanning→welding mask character→immersion gold→open lid forming→laser depth control→electrical measurement→rigid board forming→flexible board forming→FQC→packaging
3. Manufacturing difficulties
4. Application areas
These rigid-flex boards use a face recognition module. It is a combination of the rigid and flexible structures of HDI. This type of rigid-flex board is more and more widely used in the field of consumer electronics. As people need more electronic devices with more functions, they also need faster and faster electronic devices, so the rigid-flex board of HDI structure came into being. It has a faster transmission efficiency than through-hole plates, while the volume can be smaller.