1. Laminated structure
2. Production process
Flexible board cutting → drilling → black hole VCP → circuit etching → AOI scanning → pressing cover film → pressing → laser drilling → drilling → electroplating hole filling → circuit etching → AOI scanning → pressing → laser drilling → Drilling → Immersion copper plate electricity → Resin plug hole → Immersion copper plate electricity → Outer circuit etching (alkaline etching) → AOI scanning → Solder mask characters → Immersion gold → Open cover forming → Mechanical depth control → Electrical measurement → rigid board forming → flexible board molding → dispensing → FQC → packaging
3. Manufacturing difficulties
4. Application areas
This rigid-flex board is used in Bluetooth headsets. It is a rigid-flex board with an HDI structure. Due to the higher transmission speed of the HDI structure of the rigid-flex board than the through-hole board, theoretically speaking, the sound quality will be better than that of the through-hole board structure, and it can integrate more functions.