1.Laminated structure
2.Production Process
1) FPC process: Flex Board Cutting→Drill Locating Hole→Image→AOI→Cover Film→Lamination
2) Rigid PCB: Rigid Board Cutting→Drill Locating Hole→Rigid Board Pre-treatment
3)Main process: Rigid-Flex Fusion→Drilling→PTH→Outer Layer→Outer Layer AOI→Solder Mask→Finishing→Screen→Gong Open Lid→Routing→E-Tes→FQC→Packaging
3. Process difficulties
Rigid-flex board structure: HDI+ flying tail structure.
The feature of this structure is that the flexible board through-hole conduction design, the rigid board laser blind hole realizes the conduction of adjacent layers, which realizes the high integration and three-dimensional assembly of the circuit, and the structure is more precise and dense.
Three times of electroplating, two times of pressing.
Through-hole plating in the flexible board area to realize the network connection between the flexible board layers. The laser blind hole micro-hole process adopts the direct hole forming process of UV laser and the plasma glue removal process to achieve good blind hole quality. The aperture is 75um with the ring 75um, and the line uses LDI ultraviolet laser direct image transfer to achieve a fine line. Blind hole filling and electroplating to meet the flatness of copper surface with good BGA position,
Two times of pressing, one pressing of NF PP, NFPP meets the design requirements of good rigid-flex handover position, and the equipment adopts a high-temperature transfer press.
Secondary pressure high TG flow glue PP compression, high TG materials provide better environmental applications of products, high-temperature transmission pressure application high TG compression parameters to achieve a good combination of materials.
PI reinforced local fit and asymmetric pressing. Filling accessories with high section differences are used during pressing to achieve a good reinforcement combination.
