1. Laminated structure
2. Production process
Flexible board cutting → drilling → black hole VCP → circuit etching → AOI scanning → pressing cover film → lamination → laser drilling → Immersion copper and pattern plating → Outer layer etching (alkaline etching) → AOI scanning → Solder mask and characters → Immersion gold → Opening and routing → Mechanical depth control → Electrical test → rigid board routing → flexible board routing → FQC → packaging
