Lens module board

Layers     4L
Stack-up :1R+2F+1R
Thickness   0.3mm
Out Layer Copper Thickness: 1OZ
Inner Layer Copper Thickness: 1OZ
Min hole size 0.15mm
Min Line Width/Space:  3mil
Surface finish:ENEPIG
Application :Camera module / Industrial camera
Features : super-thin rigid-flex pcb