Blind hole board

Layers  :  4L
Thickness  :  0.8mm
Out Layer Copper Thickness:  H OZ
Inner Layer Copper Thickness: H OZ
Min hole size 0.1mm
Min Line Width/Space:  3mil
Surface finish : ENIG
Application :Banking USB Key
Features : High Density Interconnection + impedance matching

Shenzhen Renchuangyi Electronics Co., Ltd
Tel: 0755-27314226
Address:
Building 4, JinFeng Industry Zone, Heping Village, Fuyong Town, Bao’an District, Shenzhen, Guangdong Province, PRC.:
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