OSP ENIG Board

Layers   : 4L
Thickness : 1.2mm
Out Layer Copper Thickness :  H OZ
Inner Layer Copper Thickness : H OZ
Min hole size : 0.2mm
Min Line Width/Space :  4mil
Surface finish : ENIG+osp
Application :Computer memory board / Consumer electronics
Features : ICE immersion Gold ,other solder pad,OSP