RCY ELECTRONIC : Technical requirements you must know for PCB base material

In recent years, the PCB market has shifted from computers to communications,including base stations, servers, and mobile terminals.

In addition,mobile communication devices represented by smart phones have driven PCBs toward higher density, thinner, and higher multi-functions.

And also, the manufacturing technology of printed circuit board is inseparable from substrate materials,

which also involves the technical requirements of PCB base material


1 Requirements of high frequency and high speed

Electronic communication technology ranges from wired to wireless, from low frequency, low speed to high frequency and high speed.

Now the performance of mobile phones has entered 4G and will move towards 5G,which means faster transmission speed and larger transmission capacity.

What’s more,the arrival of the global cloud computing era has doubled the data traffic,and the requirements of high-speed and high-speed

for communication equipment is an inevitable trend. In order to meet the PCB requirements for high frequency and high speed transmission needs

In addition to reducing signal interference and loss in circuit design,maintaining signal integrity,and PCB manufacturing to meet design requirements

it is also important to have high-performance substrates and high frequency and high speed base material 


2 Requirements of  high heat dissipation needs

Along with the miniaturization and high function of electronic devices,high heat generation and the thermal management requirements of electronic devices are increasing

One solution selected is to develop a thermally conductive printed circuit board. However, the  first condition for heat-resistant and heat-dissipating PCBs

is the heat resistance and heat dissipation of the substrate. At present, the improvement of the substrate through the resin and the addition of fillers improve the heat resistance and heat dissipation to a certain extent

but the thermal conductivity improvement is very limited. Typically, a metal substrate (IMS) or a metal core printed circuit board is used to dissipate heat from the heat generating component

which is smaller than the conventional heat sink and fan cooling, and reduces the cost.


3  Requirements of Flexible and rigid-flex material

The miniaturization and thinning of electronic equipment will inevitably use a large number of flexible printed circuit boards

(FPCB) and rigid-flex printed circuit boards (R-FPCB), which means the pcb base material has to adapt to this trend and change

In addition to adapting to high-speed and high-frequency signal transmission requirements,

the dielectric constant and dielectric loss of flexible substrates must also be concerned

Polytetrafluoroethylene and advanced polyimide substrates can b e used to form FPCB, application market such as smartphones




is a professional and trusted pcb manufacturer in Shenzhen, China, specialises in multilayer pcb, HDI pcb, and rigid-flex pcb


Shenzhen Renchuangyi Electronics Co., Ltd
Tel: 0755-27314226
Building 4, JinFeng Industry Zone, Heping Village, Fuyong Town, Bao’an District, Shenzhen, Guangdong Province, PRC.:
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