RCY ELECTRONIC : the Most suitable Layer Stack-up for 6-layer High-speed PCB boards
As is well-known, Multi-layer PCBs such as 6-layer circuit boards are widely used in the fields of
medical devices, industrial control, and embedded systems. It requires High frequency and High-speed PCB boards to meet the needs in these fields
However, we will always encounter some problems when designing the pcb Layer Stack-up for Multi-layer PCBs, like 6 Layers PCB of High-speed.
Today, let’s talk about the Layer Stack-up that used in 6 Layers PCBs
Common layer Stack-up
First of all, we will introduce the common layer Stack-up that PCB circuit board factory uses mostly
However, this structure i s used for ordinary PCB boards without high-speed signals.
the GND layer and power layer effectively shield the Top layer from the Siganl_1, Bottom layer to the Siganl_2 interference.
In addition, more than 20 mils between Siganl_1 and Siganl_2 reduces crosstalk between the two signal layers.
In this PCB layer Stack-up ,the GND layer and the power layer are fully coupled
The signal layer between the Top layer and the Siganl_1/Siganl_2 to Bottom layer is relatively prone to crosstalk,
And also, the signal isolation effect is not good.
In this PCB layer Stack-up, the GND layer and the power layer effectively shield the cross-talk of the signal between the Top layer, the Siganl_1, and the Bottom layer
adding a GND layer and reducing a signal layer
However,this PCB layer Stack-up is obviously optimal in terms of shielding cross-talk,
and the disadvantage is that a layer of signal is missing