| Item | Technical specification | Illustration |
|---|---|---|
| Layer Count | 2-18 L |  |
| Base Material | FR4 (TG135/TG150/TG170/CAF/CTI>600/halogen/halogen free) & FCCL(IT/Hongren/Taihong/DuPont/Panasonic) | |
| Max.panel size | 400mm*540m | |
Final Board Thickness | 0.25-3.2mm |  |
| Tolerance of Final Board Thickness | ± 10% | |
Min line Width/Space | 2mil/2mil（50um/50um） |  |
Min hole to line Spacing | 5mil（125um）for 2L，6mil（150um）for 4L，7mil（178um）for 6L and above |  |
| Minimum BGA clamping line | 3.5mil（89um） | |
| Copper thickness | ⅓ - 1 oz(Inner Layer) ; ⅓ - 2 oz(Outer Layer) | |
Inter-layer alignment accuracy | 2mil/2mil(50um/50um) |  |
| Min Hole Diamete | ≥0.1mm( Mechanical hole)；≥0.075mm（ Laser hole） | |
| Hole Diameter Tolerance | ±0.075 mm（3mil） | |
Aspect ratio | 12:1 |  |
| Etching Tolerance | ±10% / ±1.5mil | |
| Solder Mask Thickness | 10-30 um | |
Min Solder Mask Bridge | 4mil (100um) |  |
| Solder Mask Plug Hole Max Diameter | 0.6 mm | |
| Surface Treatment | HASL/LF-HASL,Gold Finger，Hard Gold，OSP，Immersion Gold，Immersion Tin，Immersion Silver | |
| Gold Thickness | 1-3u"( Immersin Gold) ；≤50u"（Hard Gold） | |
Impedance Control Tolerance | ±10% |  |
Warp and Twist | ≤0.5% |  |
| Peel strength | ≥107g/mm |
