Rigid-flex PCB Process Capability

ItemTechnical specification Illustration

Layer Count

2-18 L
1 2 - Rigid-flex PCB Process Capability
Base MaterialFR4 (TG135/TG150/TG170/CAF/CTI>600/halogen/halogen free) & FCCL(IT/Hongren/Taihong/DuPont/Panasonic)
Max.panel size400mm*540m

Final Board Thickness

0.25-3.2mm
2 1 - Rigid-flex PCB Process Capability
Tolerance of Final Board Thickness± 10%

Min line Width/Space

2mil/2mil(50um/50um)
3 1 - Rigid-flex PCB Process Capability

Min hole to line Spacing

5mil(125um)for 2L,6mil(150um)for 4L,7mil(178um)for 6L and above
4 1 - Rigid-flex PCB Process Capability
Minimum BGA clamping line3.5mil(89um)
Copper thickness⅓ - 1 oz(Inner Layer) ; ⅓ - 2 oz(Outer Layer)

Inter-layer alignment accuracy

2mil/2mil(50um/50um)
5 2 - Rigid-flex PCB Process Capability
Min Hole Diamete≥0.1mm( Mechanical hole);≥0.075mm( Laser hole)
Hole Diameter Tolerance±0.075 mm(3mil)

Aspect ratio

12:1
6 1 - Rigid-flex PCB Process Capability
Etching Tolerance±10% / ±1.5mil
Solder Mask Thickness10-30 um

Min Solder Mask Bridge

4mil (100um)
7 - Rigid-flex PCB Process Capability
Solder Mask Plug Hole Max Diameter0.6 mm
Surface TreatmentHASL/LF-HASL,Gold Finger,Hard Gold,OSP,Immersion Gold,Immersion Tin,Immersion Silver
Gold Thickness1-3u"( Immersin Gold) ;≤50u"(Hard Gold)

Impedance Control Tolerance

±10%
8 - Rigid-flex PCB Process Capability

Warp and Twist

≤0.5%
9 1 - Rigid-flex PCB Process Capability
Peel strength≥107g/mm