Item | Technical specification | Illustration |
---|---|---|
Layer Count | 2-18 L | |
Base Material | FR4 (TG135/TG150/TG170/CAF/CTI>600/halogen/halogen free) & FCCL(IT/Hongren/Taihong/DuPont/Panasonic) | |
Max.panel size | 400mm*540m | |
Final Board Thickness | 0.25-3.2mm | |
Tolerance of Final Board Thickness | ± 10% | |
Min line Width/Space | 2mil/2mil(50um/50um) | |
Min hole to line Spacing | 5mil(125um)for 2L,6mil(150um)for 4L,7mil(178um)for 6L and above | |
Minimum BGA clamping line | 3.5mil(89um) | |
Copper thickness | ⅓ - 1 oz(Inner Layer) ; ⅓ - 2 oz(Outer Layer) | |
Inter-layer alignment accuracy | 2mil/2mil(50um/50um) | |
Min Hole Diamete | ≥0.1mm( Mechanical hole);≥0.075mm( Laser hole) | |
Hole Diameter Tolerance | ±0.075 mm(3mil) | |
Aspect ratio | 12:1 | |
Etching Tolerance | ±10% / ±1.5mil | |
Solder Mask Thickness | 10-30 um | |
Min Solder Mask Bridge | 4mil (100um) | |
Solder Mask Plug Hole Max Diameter | 0.6 mm | |
Surface Treatment | HASL/LF-HASL,Gold Finger,Hard Gold,OSP,Immersion Gold,Immersion Tin,Immersion Silver | |
Gold Thickness | 1-3u"( Immersin Gold) ;≤50u"(Hard Gold) | |
Impedance Control Tolerance | ±10% | |
Warp and Twist | ≤0.5% | |
Peel strength | ≥107g/mm |